THERMAL ANALYSIS OF REMOTE INTERFACE UNIT CONTROL

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BODDU RAJU; KOILADA ABHINASH

THERMAL ANALYSIS OF REMOTE INTERFACE UNIT CONTROL

Authors: BODDU RAJU, KOILADA ABHINASH

Unique Paper ID: 182660
Volume: 12
Issue: 2
PageNo: 2743-2749

Keywords: No Keywords Found

Abstract:
This project presents a comprehensive thermal analysis of a Remote Interface Control Unit (RICU) utilized in embedded systems for remote control and communication. The RICU's thermal behavior is investigated under various operating conditions, including extreme temperatures, humidity, and load variations. Through simulation modeling and experimental validation, this study aims to identify critical hot spots, evaluate heat distribution, and propose design improvements to enhance thermal performance and reliability. The analysis employs advanced simulation tools to model heat transfer mechanisms, thermal interfaces, and material properties. The results provide valuable insights into the RICU's thermal behavior, enabling the development of optimized design solutions to mitigate thermal-related issues. This project contributes to the advancement of embedded systems design, particularly in applications where thermal management is crucial, such as aerospace, automotive, and industrial control systems. The findings and methodologies presented in this study can be applied to improve the reliability, efficiency, and performance of RICUs in various industries.

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Cite This Article

ISSN: 2349-6002
Volume: 12
Issue: 2
PageNo: 2743-2749

THERMAL ANALYSIS OF REMOTE INTERFACE UNIT CONTROL

Available:https://ijirt.org/Article?manuscript=182660

Impact Factor
8.01 (Year 2024)

UGC Approved
Journal no 47859

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