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@article{199053,
        author = {Infant Amalan. G and Jaiganesh. M and Dr. J. Kingston Barnabas. M.E., Ph.D and Pradeep Kumar. N and Saravanan. R},
        title = {ANALYSIS OF HEAT SINK PERFORMANCE WITH ALTERNATIVE PIN-FIN GEOMETRY USING ANSYS},
        journal = {International Journal of Innovative Research in Technology},
        year = {2026},
        volume = {12},
        number = {11},
        pages = {12654-12661},
        issn = {2349-6002},
        url = {https://ijirt.org/article?manuscript=199053},
        abstract = {This paper presents a comprehensive thermal analysis of heat sink performance using different pin-fin geometries — circular, rectangular, and triangular — with two fin configurations (16 fins and 25 fins) for aluminium and copper materials. Steady-state thermal simulations were performed using ANSYS Workbench with Finite Element Analysis (FEA). The 3D parametric models were created using CATIA V5. The results demonstrate that triangular fin geometry consistently achieved the lowest temperature distribution and superior heat dissipation for both materials. Copper outperformed aluminium due to its higher thermal conductivity of 385 W/m·K. Increasing fin count from 16 to 25 yielded a marginal but consistent improvement in thermal performance across all geometries. The study concludes that triangular copper pin fins with 25 fins offer the best thermal performance among all configurations tested, making them suitable for electronic cooling and IC engine cooling applications where space and efficiency are critical.},
        keywords = {ANSYS, Aluminium, Copper, Extended Surfaces, FEA, Fin Geometry, Heat flux, Heat sink, Natural convection, Pin-fin, Temperature distribution, Thermal analysis.},
        month = {April},
        }