THERMAL PERFORMANCE ANALYSIS OF HYBRID AIR AND LIQUID COOLING SYSTEMS FOR PC PROCESSORS

  • Unique Paper ID: 180115
  • Volume: 12
  • Issue: 1
  • PageNo: 160-163
  • Abstract:
  • This study examines a hybrid air and liquid cooling system designed to improve heat dissipation in high-performance PC processors. The system integrates aluminum fins and a copper liquid cooling pipe, supported by a single fan, to enhance thermal efficiency through combined convection and conduction. Evaluation was carried out using CFD simulations (ANSYS) and Data Acquisition (DAQ) testing. Thermocouples, temperature probes, and flow sensors were placed at key locations such as the processor surface and coolant outlet to measure real time thermal performance.DAQ data validated the simulation results, confirming the system’s accuracy and efficiency. Future improvements will focus on optimizing fin design, pipe configuration, and using advanced materials to boost performance further.

Cite This Article

  • ISSN: 2349-6002
  • Volume: 12
  • Issue: 1
  • PageNo: 160-163

THERMAL PERFORMANCE ANALYSIS OF HYBRID AIR AND LIQUID COOLING SYSTEMS FOR PC PROCESSORS

Related Articles