THERMAL PERFORMANCE ANALYSIS OF HYBRID AIR AND LIQUID COOLING SYSTEMS FOR PC PROCESSORS

  • Unique Paper ID: 180115
  • Volume: 12
  • Issue: 1
  • PageNo: 160-163
  • Abstract:
  • This study examines a hybrid air and liquid cooling system designed to improve heat dissipation in high-performance PC processors. The system integrates aluminum fins and a copper liquid cooling pipe, supported by a single fan, to enhance thermal efficiency through combined convection and conduction. Evaluation was carried out using CFD simulations (ANSYS) and Data Acquisition (DAQ) testing. Thermocouples, temperature probes, and flow sensors were placed at key locations such as the processor surface and coolant outlet to measure real time thermal performance.DAQ data validated the simulation results, confirming the system’s accuracy and efficiency. Future improvements will focus on optimizing fin design, pipe configuration, and using advanced materials to boost performance further.

Copyright & License

Copyright © 2025 Authors retain the copyright of this article. This article is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

BibTeX

@article{180115,
        author = {Dr.R.PREMKUMAR,Ph.D., and M.MUKESH and Dr.S.DEVI,Ph.D.,},
        title = {THERMAL PERFORMANCE ANALYSIS OF HYBRID AIR AND LIQUID COOLING SYSTEMS FOR PC PROCESSORS},
        journal = {International Journal of Innovative Research in Technology},
        year = {2025},
        volume = {12},
        number = {1},
        pages = {160-163},
        issn = {2349-6002},
        url = {https://ijirt.org/article?manuscript=180115},
        abstract = {This study examines a hybrid air and liquid 
cooling system designed to improve heat dissipation in 
high-performance PC processors. The system 
integrates aluminum fins and a copper liquid cooling 
pipe, supported by a single fan, to enhance thermal 
efficiency 
through combined convection and 
conduction. Evaluation was carried out using CFD 
simulations (ANSYS) and Data Acquisition (DAQ) 
testing. Thermocouples, temperature probes, and flow 
sensors were placed at key locations such as the 
processor surface and coolant outlet to measure real
time thermal performance.DAQ data validated the 
simulation results, confirming the system’s accuracy 
and efficiency. Future improvements will focus on 
optimizing fin design, pipe configuration, and using 
advanced materials to boost performance further.},
        keywords = {Hybrid cooling, Air-liquid cooling  system, Thermal performance, Heat dissipation,  Aluminum fins, Copper cooling pipe, Processor  cooling, CFD simulation (ANSYS), Data Acquisition  (DAQ),Temperature reduction, Heat flux.},
        month = {May},
        }

Cite This Article

  • ISSN: 2349-6002
  • Volume: 12
  • Issue: 1
  • PageNo: 160-163

THERMAL PERFORMANCE ANALYSIS OF HYBRID AIR AND LIQUID COOLING SYSTEMS FOR PC PROCESSORS

Related Articles