A review on design and analysis of liquid cooled cold plates using CAD modeling

A review on design and analysis of liquid cooled cold plates using CAD modeling
Author(s):
Pratik Nandkishor Raut, Prof. Mahendra P. Nawathe
Keywords:
Liquid Cooling, Cold Plates, Temperature, Heat Transfer, Electronic Applications
Abstract
For cooling electronic systems new techniques are invented. Cold plate is liquid cooling system used in electronic components. In present work, the modification is done in design of cold plate to reduce its cost and also to increase the heat dissipation rate. Water at various flow rates is supplied for given power inputs and heat removing capacity of each flow rate at that particular heat load is calculated. It is found that water is best working fluid for all flow rates. Methanol and acetone are best suited for high mass flow rates. The cold plate is used to provide a “cold wall” to which individual electronic components are mounted. The design and performance evaluation of a cold plate follows a prescribed procedure that depends on the heat loading and whether the heat loading is on one or two sides of the cold plate. Due to transmission of applied current and voltage sometimes the temperature of the circuit plate goes increasing. This temperature limits the electronic operation. Thus it is necessary to control such temperature, in order to maintain speed of electronic devices.
Article Details
Unique Paper ID: 147364 Publication Volume & Issue: Volume 5, Issue 7 Page(s): 231 - 235
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