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@article{154671,
        author = {Harsh Sharma Mehra and GJ Nithin and Dinesh Kumar Nayak and Raj Krishna and Praveen A},
        title = {Review on Intelligent Packaging System for Tamperproof Delivery},
        journal = {International Journal of Innovative Research in Technology},
        year = {},
        volume = {8},
        number = {12},
        pages = {12-19},
        issn = {2349-6002},
        url = {https://ijirt.org/article?manuscript=154671},
        abstract = {E-commerce, also known as electronic commerce, refers to buying and selling various goods and services online. In recent days, the word “eCommerce “has become very familiar due to the internet boom and the kind of comfort (and other services) it provides to its users. Many companies have either established their business or have increased their profits with the help of eCommerce. Many studies show an exponential increase in eCommerce sales and services, and it will reach new heights in the upcoming years. Ecommerce businesses have seen a 265% growth rate, from $1.3 trillion in 2014 to $4.9 trillion in 2021, also higher. With such a mass boom in eCommerce, people don’t prefer to buy goods offline since they receive more benefits by buying online. But unfortunately, there are a few problems that both the company and its customers face. And gradually, such issues have been increasing, and significant issues were concerning the faulty delivery system. To handle such situations, we propose a solution to avoid any delivery-related problems caused during delivery and stop such problems by ensuring every customer gets the products as it is by the dealer directly without any interference while delivering. This report discusses the part of IoT in secured packaging solutions and the proposed approach.},
        keywords = {Intelligent Packaging, Node MCU, GPS , Sensors, Arduino Uno.},
        month = {},
        }