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@article{206048,
        author = {Gari Lakshman and Vommi Pradeep Kumar and Dr. G.Ramu},
        title = {Design and CFD Analysis of Heat- Sink with different channel shapes for high power electronics cooling},
        journal = {International Journal of Innovative Research in Technology},
        year = {2026},
        volume = {13},
        number = {2},
        pages = {79-82},
        issn = {2349-6002},
        url = {https://ijirt.org/article?manuscript=206048},
        abstract = {This study presents a computational fluid dynamics (CFD) analysis of pin-fin heat sinks for high-power electronics cooling. Geometries were modeled in CATIA and simulated in ANSYS Fluent to evaluate the effects of fin diameter, spacing, and height on heat transfer coefficient (HTC), Nusselt number (Nu), friction factor, Performance Evaluation Criteria (PEC), and pressure drop. Results show that smaller fin diameters (3 mm), reduced spacing, and increased fin height enhance thermal performance, though at the cost of higher pressure drop. The optimal configuration—3 mm diameter, 7 mm height, and 4 mm spacing—achieved improved heat transfer with balanced hydraulic resistance. Validation against literature confirmed the reliability of the simulations, with fin height contributing up to a 20% increase in heat transfer rate. These findings provide design guidelines for optimizing pin-fin heat sinks to improve cooling efficiency in high-power electronic applications.},
        keywords = {heat sink, Pin-fin geometry, CFD analysis, High-power electronics cooling, Heat transfer coefficient, Nusselt number, Pressure drop, Performance Evaluation Criteria, Optimization, ANSYS Fluent, CATIA modeling.},
        month = {July},
        }