A REVIEW ON STEADY-STATE, ONE-DIMENSIONAL HEAT TRANSFER WITH THERMAL RESISTANCE NETWORK

  • Unique Paper ID: 142614
  • Volume: 2
  • Issue: 5
  • PageNo: 1-7
  • Abstract:
  • An understanding of the mechanisms of heat transferis becoming increasingly important in today’s world. Conduction and convection heat transfer phenomena are found throughout virtually all of the physical world and the industrial domain. These two phenomena are very complicated and subjects to all bodies. To simplify their modeling for better understand of heat transfer, an analogy between thermal and electrical circuits are established. Assuming steady-state, one-dimensional heat transfer via conduction and/or convection modes, expressions are derived for thermal resistances across planar, cylindrical and spherical interfaces. Series, parallel and combination of series-parallel thermal network models are discussed (emphasizing similarity to electrical circuit theory). The equivalent thermal resistances are calculated for all thermal networks.

Copyright & License

Copyright © 2025 Authors retain the copyright of this article. This article is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

BibTeX

@article{142614,
        author = {Dinesh Kumar Naik and Prakash Kumar Sen and Gopal Sahu},
        title = {A REVIEW ON STEADY-STATE, ONE-DIMENSIONAL HEAT TRANSFER WITH THERMAL RESISTANCE NETWORK},
        journal = {International Journal of Innovative Research in Technology},
        year = {},
        volume = {2},
        number = {5},
        pages = {1-7},
        issn = {2349-6002},
        url = {https://ijirt.org/article?manuscript=142614},
        abstract = {An understanding of the mechanisms of heat transferis becoming increasingly important in today’s world. Conduction and convection heat transfer phenomena are found throughout virtually all of the physical world and the industrial domain. These two phenomena are very complicated and subjects to all bodies. To simplify their modeling for better understand of heat transfer, an analogy between thermal and electrical circuits are established.  Assuming steady-state, one-dimensional heat transfer via conduction and/or convection modes, expressions are derived for thermal resistances across planar, cylindrical and spherical interfaces.  Series, parallel and combination of series-parallel thermal network models are discussed (emphasizing similarity to electrical circuit theory). The equivalent thermal resistances are calculated for all thermal networks.},
        keywords = {heat, conduction, convection, resistance, network},
        month = {},
        }

Cite This Article

  • ISSN: 2349-6002
  • Volume: 2
  • Issue: 5
  • PageNo: 1-7

A REVIEW ON STEADY-STATE, ONE-DIMENSIONAL HEAT TRANSFER WITH THERMAL RESISTANCE NETWORK

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