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@article{210559,
        author = {Gaurav Dabhade and Khurram Murad and Gaurav Nikalje and Sachin Komble and Pramod Kale and Ganesh Dongre},
        title = {Thermal Performance Analysis of Heat Sink with and without PCM},
        journal = {International Journal of Innovative Research in Technology},
        year = {2026},
        volume = {13},
        number = {6},
        pages = {1460-1469},
        issn = {2349-6002},
        url = {https://ijirt.org/article?manuscript=210559},
        abstract = {The effective thermal management of high-power electronic devices is essential for maintaining reliable performance and preventing overheating. Phase change material (PCM)-integrated heat sinks offer a promising passive cooling approach by absorbing and storing excess thermal energy during phase transition. This study investigates the thermal performance of a PCM-based heat sink using three-dimensional transient numerical simulations in ANSYS Fluent. Temperature distribution, phase change behavior, and heat transfer characteristics are analyzed and compared with those of a conventional heat sink without PCM. The results indicate that incorporating PCM significantly reduces the base and average temperatures of the heat sink. Complete melting of the PCM occurs after 2000 seconds under steady heat input conditions, demonstrating its thermal energy storage and temperature regulation capabilities. Furthermore, the numerical results are validated against previously published experimental data, showing close agreement and supporting the reliability of the simulation methodology. The study concludes that PCM-integrated heat sinks provide an effective passive cooling solution for improving the thermal management of high-power electronic devices.},
        keywords = {Heat sink optimization, Phase transition material, Cooling of Electronic components, Heat dissipation, Passive thermal regulation, High energy electronic system, Overheating in electronics, Energy storage material.},
        month = {November},
        }